HM66-106R8(V2) Просмотр технического описания (PDF) - BI Technologies
Номер в каталоге
Компоненты Описание
производитель
HM66-106R8 Datasheet PDF : 8 Pages
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SOLDER PAD LAYOUTS (Inch/mm)
Figure 1
HJ
J
Figure 2
I
I
Figure 3
J
H
J
I
J
H
J
Case Size Figure
A
B
C Max.
D
E
F
G Max.
H
I
J
10
1
.150±.02 .150±.02
.071 .045±.01
3.8±0.5 3.8±0.5
1.8 1.15±.0.25
.110±004 .205
.095
.061
.055
2.8±0.1
5.2
2.4
1.55
1.4
15
2 .150±.012 .150±.012 .073 .150±.012 .043±.006 .150±.012 .173
.043
.177
.067
3.8±0.3 3.8±0.3
1.85
3.8±0.3 1.1±0.15 3.8±0.3
4.4
1.1
4.5
1.7
20
2
.185±.02 .185±.02
.083 .177±.012 .059±.006 .177±.012 .272
.059
.209
.075
4.7±0.5 4.7±0.5
2.1
4.5±0.3 1.5±0.15 4.5±0.3
6.9
1.5
5.3
1.9
30
2
.185±.02 .185±.02
.119 .177±.012 .059±.006 .177±.012 .272
.059
.209
.075
4.7±0.5 4.7±0.5
3.0
4.5±0.3 1.5±0.15 4.5±0.3
6.9
1.5
5.3
1.9
40
2
.225±.02 .225±.02
.079 .217±.012 .079±.006 .217±.012 .323
.079
.248
.085
5.7±0.5 5.7±0.5
2.0
5.5±0.3 2.0±0.15 5.5±0.3
8.2
2.0
6.3
2.15
6
50
2
.225±.02 .225±.02
.119 .217±.012 .079±.006 .217±.012 .323
.079
.248
.085
5.7±0.5 5.7±0.5
3.0
5.5±0.3 2.0±0.15 5.5±0.3
8.2
2.0
6.3
2.15
60
2
.264±.02 .264±.02
.119 .256±.012 .079±.006 .256±.012 .375
.079
.288
.105
6.7±0.5 6.7±0.5
3.0
6.5±0.3 2.0±0.15 6.5±0.3
9.5
2.0
7.3
2.65
70
2
.264±.02 .264±.02
.158 .256±.012 .079±.006 .256±.012 .375
.079
.288
.105
6.7±0.5 6.7±0.5
4.0
6.5±0.3 2.0±0.15 6.5±0.3
9.5
2.0
7.3
2.65
80
3
.394±.02 .402±.02
.158 .118±0.004 .303±.012 .047±.006
10.0±0.5 10.2±0.5
4.0
3.0±0.1 7.7±0.3 1.2±0.15
.288
.126
.067
7.3
3.2
1.7
6-125
Model HM66 Series
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