HLMP-RB11 Просмотр технического описания (PDF) - HP => Agilent Technologies
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HLMP-RB11 Datasheet PDF : 8 Pages
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Part Numbering System
HLMP - x x xx - x x x xx
Mechanical Options
00: Bulk Packaging
DD: Ammo Pack
YY: Flexi-Bin; Bulk Packaging
ZZ: Flexi-Bin; Ammo Pack
Color Bin & VF Selections
0: No Color Bin Limitation
R: Amber Color Bins 1, 2, 4, and 6 with VF Maximum of 2.6 V
T: Red Color with VF Maximum of 2.6 V
V: Amber Color Bins 1, 2, 4, and 6 with VF Maximum of 2.6 V
Maximum Intensity Bin
0: No Iv Bin Limitation
Minimum Intensity Bin
Refer to Device Selection Guide
Color
B: 470 nm Blue
D: 630 nm Red
G: 626 nm Red
L: 590/592 nm Amber
M: 526 nm Green
Package
R: 4 mm 60º x 120º Oval, Parallel
S: 4 mm 60º x 120º Oval, Perpendicular
Absolute Maximum Ratings
TA = 25°C
Parameter
DC Forward Current[1]
Peak Pulsed Forward Current
Average Forward Current
Reverse Voltage (IR = 100 µA)
Power Dissipation
LED Junction Temperature
Operating Temperature Range
Storage Temperature Range
Soldering Temperature
Note:
1. Derate linearly as shown in Figures 6 and 7.
Blue and Green
30 mA
100 mA
30 mA
5V
120 mW
130°C
–40°C to +80°C
–40°C to +100°C
260° for 5 sec
4
Amber and Red
50 mA
100 mA
30 mA
5V
120 mW
130°C
–40°C to +100°C
–40°C to +120°C
260° for 5 sec
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