HI-1570 Просмотр технического описания (PDF) - Holt Integrated Circuits

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Компоненты Описание

производитель

HI-1570

MIL-STD-1553 / 1760 5V Monolithic Dual Variable AmplitudeTransceiver

Holt Integrated Circuits 

PACKAGE DIMENSIONS

20-PIN PLASTIC SMALL OUTLINE (ESOIC) - WB

(Wide Body, Thermally Enhanced)

.407 ± .013

(10.325 ± .32)

.504 ± .008

(12.79 ± .19)

Top View

.0105 ± .0015

(.267 ± .038)

.295 ± .002

(7.493 ± .05)

.205 typ

(5.21)

inches (millimeters)

Package Type: 20HWE

.290 typ

(7.37)

Bottom

View

.0165 ± .0035

(.419 ± .089)

See Detail A

.090 ± .01

(2.29 ± .25)

.050

(1.27)

BSC

BSC = “Basic Spacing between Centers”

is theoretical true position dimension and

has no tolerance. (JEDEC Standard 95)

0° to 8°

.033 ± .017

(.838 ± .432)

.0075 ± .004

(.191 ± .089)

Detail A

Electrically isolated heat sink

pad on bottom of package.

Connect to any ground or

power plane for optimum

thermal dissipation.

20-PIN CERAMIC SIDE-BRAZED DIP

inches (millimeters)

Package Type: 20C

1.000 ±.010

(25.400 ±.254)

.200

(5.080)

max

.050 TYP.

(1.270 TYP.)

.310 ±.010

(7.874 ±.254)

.085 ±.009

(2.159 ± .229)

.300 ± .010

(7.620 ± .254)

.125 min

(3.175)

BSC = “Basic Spacing between Centers”

is theoretical true position dimension and

has no tolerance. (JEDEC Standard 95)

.017 ±.002

(.432 ±.051)

.100

(2.54) BSC

HOLT INTEGRATED CIRCUITS

10

.010 + 0. 02/-.001

(.254 ±.051/-.025)

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