FT0407MD00 Просмотр технического описания (PDF) - Formosa Technology
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FT0407MD00 Datasheet PDF : 5 Pages
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FT04...D
Fig. 1: Maximum power dissipation versus
RMS on-state current
P (W)
6.0
5.0
4.0
3.0
α = 180 º
α = 120 º
α = 90 º
α = 60 º
2.0
1.0 α = 30 º
180 º
α
α
0.0
IT(RMS)(A)
0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0
Fig. 3: RMS on-state current versus ambient
temperature
I T(RMS) (A)
4.5
Rth(j-a) = Rth(j-c)
4.0
3.5
3.0
2.5
2.0
Rth(j-a) = 55 ºC/W
1.5
S(Cu) = 1.75 cm2
1.0
0.5
α = 180 º
0.0
Tamb (ºC)
0 10 20 30 40 50 60 70 80 90 100 110
Fig. 5: Relative variation of gate trigger current
and holding current versus junction temperature
(typical values).
IGT, IH (Tj) / IGT, IH (Tj = 25 ºC)
2.5
2.0
IGT
1.5
IH
1.0
0.5
0.0
Tj (ºC)
-40 -20 0 20 40 60 80 100 120
SURFACE MOUNT TRIAC
Fig. 2: Correlation between maximum power dissipation
and maximum allowable temperatures (Tamb and Tcase)
for different thermal resistances heatsink + contact.
P (W)
6.0
Rth=10 ºC/W
5.0
4.0
Rth=15 ºC/W
T case (ºC)
Rth=5 ºC/W
Rth=0 ºC/W
-95
-100
3.0
2.0
-105
1.0
α = 180 º
0.0
-110 Tamb (ºC)
0 10 20 30 40 50 60 70 80 90 100 110
Fig. 4: Relative variation of thermal impedance
junction to case versus pulse duration.
K = [(Zth(j-c) / Rth (j-c)]
1.00
0.50
0.20
0.10
1E-3
1E-2
tp (s)
1E-1
1E+0
Fig. 6: Non repetitive surge peak on-state
current versus number of cycles.
I TSM (A)
30
25
Tj initial = 25 ºC
F = 50 Hz
20
15
10
5
0
Number of cycles
1
10
100
1000
Jul - 03
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