HIP0060 Просмотр технического описания (PDF) - Intersil
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HIP0060 Datasheet PDF : 7 Pages
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HIP0060
Absolute Maximum Ratings
Max Output Voltage, VOUT (Note 2) . . . . . . . . . . . . . . . . . . . . . VOC
Max Output Load Current, ILOAD (Per Output, Note 3) . . . . . . . . ICL
Logic Input Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.3V to 7V
Logic Supply Voltage, VDD . . . . . . . . . . . . . . . . . . . . . . -0.3V to +7V
Operating Conditions
Ambient Temperature Range . . . . . . . . . . . . . . . . . -40oC to 125oC
Junction Temperature Range . . . . . . . . . . . . . . . . -40oC to 150oC
Thermal Information
Thermal Resistance (Typical, Notes 1, 4)
θJA (oC/W)
SOIC - PC Board Mount, Min. Copper . . . . . . . . . .
60
SOIC - PC Board Mount, 2 sq. in. Copper . . . . . . . .
35
Maximum Storage Temperature Range -55oC to 150oC
Maximum Lead Temperature (Soldering 10s) . . . . . . . . . . . . . 300oC
(SOIC - Lead Tips Only)
CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation
of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied.
NOTES:
1. θJA is measured with the component mounted on an evaluation PC board in free air.
2. The MOSFET Output Drain is internally clamped with a Drain-to-Gate zener diode that turns on the MOSFET; holding the Drain at the
Output Clamp voltage VOC.
3. The output drive is protected by an internal current limit. The ICL over-current limiting threshold parameter specification defines the max-
imum current. The maximum current with all outputs ON may be further limited by dissipation.
4. Device dissipation is based on thermal resistance capability of the package in a normal operating environment. The junction to ambient
thermal resistance of 60oC/W is defined here as a PC Board mounted device with minimal copper. With approximately 2 square inches
of copper area as a heat sink, it is practical to achieve 35oC/W thermal resistance. Further reduction in the thermal resistance can be
achieved with additional PC Board Copper ground area or an external heat sink structure next to the ground leads at the center of the
package.
Electrical Specifications VDD = 4.5V to 5.5V, VSS = 0V, TA = -40oC to 125oC; Unless Otherwise Specified
PARAMETER
SYMBOL
CONDITIONS
MIN
TYP
MAX
OUTPUTS DRIVERS (DR0 TO DR7)
Output Channel Resistance
rDSON IOUT = 0.5A
-
-
0.8
Over-Current Limiting Threshold
ICL
1.5
-
3.5
Output Clamping Voltage
Output Clamping Energy
VOC
40
50
60
EOC 1ms Single Pulse Width, TA = 25oC,
-
85
-
(Refer to Figure 3 for SOA Limits).
Output OFF Leakage Current
Open-Load Fault Threshold
Output Rise Time
Output Fall Time
Turn-On Delay
Turn-Off Delay
POWER SUPPLY
ILK
ROLD
tR
tF
tON
tOFF
VOUT = 14.5V
VOUT = 14.5V, Output Off
RL = 30Ω, VOUT = 14.5V
RL = 30Ω, VOUT = 14.5V
RL = 30Ω, VOUT = 14.5V
RL = 30Ω, VOUT = 14.5V
-
-
180
4
-
200
1
-
12
1
-
12
-
-
12
-
-
12
UNITS
Ω
A
V
mJ
µA
kΩ
µs
µs
µs
µs
Power On Reset Threshold
VDD(POR)
VDD Logic Supply Current
IDD All Outputs ON or OFF
LOGIC INPUTS (INx, SI, SCK, RST, CS)
High Level Input Voltage
Low Level Input Voltage
Input Hysteresis
High Output Voltage, SO, INT
Low Output Voltage, SO
Input Pull-Down Current, INx
Reset Input Pull-Up Current, RST
VIH
VIL
VILHYS
V OL
V OH
IINPD
IRPU
Current Sink = 1.6mA
Current Source = -0.8mA
3.2
-
4.4
V
-
-
10
mA
0.7xVDD
-
-
V
-
-
0.2xVDD
V
0.8
-
-
V
-
-
0.4
V
VDD - 0.8
-
75
-
-
V
250
µA
20
-
120
µA
2
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