HCPL-7860 Просмотр технического описания (PDF) - HP => Agilent Technologies

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Компоненты Описание

производитель

HCPL-7860

Optically Isolated Sigma-Delta (Σ−∆) Modulator

HP => Agilent Technologies 

Solder Reflow Temperature Profile

300

PREHEATING RATE 3˚C + 1˚C/-0.5˚C/SEC.

REFLOW HEATING RATE 2.5˚C ± 0.5˚C/SEC.

PEAK

TEMP.

245˚C

200

160˚C

150˚C

140˚C

100

2.5˚C ± 0.5˚C/SEC.

3˚C + 1˚C/-0.5˚C

PREHEATING TIME

150˚C, 90 + 30 SEC.

30

SEC.

30

SEC.

PEAK

TEMP.

240˚C

SOLDERING

TIME

200˚C

PEAK

TEMP.

230˚C

50 SEC.

ROOM

TEMPERATURE

0

0

TIGHT

TYPICAL

LOOSE

50

100

150

200

250

Recommended Lead Free IR Profile

tp

Tp

TL

Tsmax

Tsmin

260 +0/-5˚C

217˚C

RAMP-UP

3˚C/SEC. MAX.

150 - 200˚C

ts

tL

PREHEAT

60 to 180 SEC.

TIME (SECONDS)

TIME WITHIN 5˚C of ACTUAL

PEAK TEMPERATURE

20-40 SEC.

RAMP-DOWN

6˚C/SEC. MAX.

60 to 150 SEC.

25

t 25˚C to PEAK

TIME (SECONDS)

NOTES:

THE TIME FROM 25˚C to PEAK TEMPERATURE = 8 MINUTES MAX.

Tsmax = 200˚C, Tsmin = 150˚C

Regulatory Information

The HCPL-7860/HCPL-786J has been approved by the following organizations:

IEC/EN/DIN EN 60747-5-2

Approved under:

IEC 60747-5-2:1997 + A1:2002

EN 60747-5-2:2001 + A1:2002

DIN EN 60747-5-2 (VDE 0884 Teil 2):2003-01.

UL

Approval under UL 1577,

component recognition program

up to VISO = 3750 VRMS.

File E55361.

CSA

Approval under CSA Component

Acceptance Notice #5, File CA

88324.

5

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