HBTGFR421-KR Просмотр технического описания (PDF) - SEOUL SEMICONDUCTOR

Номер в каталоге

Компоненты Описание

производитель

HBTGFR421-KR

CHIP LED DEVICE

SEOUL SEMICONDUCTOR 

9. Reel Structure

1.5

+0.1

-0

4.0 ±0.1

2.0 ±0.05

0.2 ±0.05

4.0 ±0.1

±0.05

0.5

1.73 ±0.05

180

+0

-3

0.7 ±0.05

11.4

9 ±0.3

13 ±0.2

2 ±0.2

22

Label

(1) Quantity : 4000pcs/Reel

(2) Cumulative Tolerance : Cumulative Tolerance/10 pitches to be ±0.2mm

(3) Adhesion Strength of Cover Tape : Adhesion strength to be 0.1-0.7N when the

cover tape is turned off from the carrier tape at 10℃ angle to be the carrier tape

(4) Package : P/N, Manufacturing data Code No. and quantity to be indicated on a

damp proof Package

Rev. 02

January 2012

WWW.SEOULSEMICON.COM

서식번호 : SSC-QP-7-07-25 (Rev.0.0)

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