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G930 Просмотр технического описания (PDF) - Global Mixed-mode Technology Inc

Номер в каталоге
Компоненты Описание
производитель
G930
GMT
Global Mixed-mode Technology Inc GMT
G930 Datasheet PDF : 5 Pages
1 2 3 4 5
Global Mixed-mode Technology Inc.
G930/G931
Absolute Maximum Ratings (Note 1)
Input Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7V
Power Dissipation Internally Limited
(Note 2)
Maximum Junction Temperature . . . . . . . . . . . . . . 150°C
Storage Temperature Range . . . .-65°C TJ +150°C
Reflow Temperature (soldering, 10sec) . . . . . .260°C
Thermal Resistance Junction to Ambient, (θJA)
SOT-89. . . . . . . . . . . . . . . . . . . . . . . . . . . . 173°C/W(1)
Thermal Resistance Junction to Case, (θJc)
SOT-89. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .25°C/W
Operating Conditions
(Note 1)
Input Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . .4V~6V
Temperature Range . . . . . . . . . . . . . . 0°C TJ 125°C
Note (1) :See P.4 Recommended Minimum Footprint.
Electrical Characteristics
VIN =5V, IO = 400mA, CIN = 1µF, COUT =10µF, All specifications apply for TA = TJ = 25°C. [Note 3]
PARAMETER
Output Voltage
Line Regulation
Load Regulation
Quiescent Current
Ripple Rejection
Dropout Voltage
Short Circuit Current
Over Temperature
CONDITIONS
5mA < IO <400mA
4V < VIN < 6V, IO = 10mA
50mA < IO < 400mA
VIN = 5V
fi = 120Hz, 1VP-P, Io = 100mA
IO = 400mA
IO = 100mA
MIN
3.43
---
---
0.3
---
---
---
---
---
TYP
3.5
3
35
0.6
50
0.8
125
1.6
150
MAX
3.605
30
50
1.5
---
0.9
---
---
---
UNITS
V
mV
mV
mA
dB
V
mV
A
°C
Note 1:
Note2:
Note3:
Note4:
Absolute Maximum Ratings are limits beyond which damage to the device may occur. Operating Conditions are
conditions under which the device functions but the specifications might not be guaranteed. For guaranteed specifications
and test conditions see the Electrical Characteristics.
The maximum power dissipation is a function of the maximum junction temperature, TJmax ; total thermal resistance, θJA,
and ambient temperature TA. The maximum allowable power dissipation at any ambient temperature is Tjmax-TA / θJA. If
this dissipation is exceeded, the die temperature will rise above 150°C and IC will go into thermal shutdown. For the
G930/G931 in SOT-89 package, θJA is 173°C/W. (See Recommended Minimum Footprint). The safe operation in SOT
-89, it can see Typical Performance Characteristics.
Low duty pulse techniques are used during test to maintain junction temperature as close to ambient as possible.
The type of output capacitor should be tantalum or aluminum.
Definitions
Dropout Voltage
The input/output Voltage differential at which the regu-
lator output no longer maintains regulation against
further reductions in input voltage. Measured when the
output drops 100mV below its nominal value, dropout
voltage is affected by junction temperature, load cur-
rent and minimum input supply requirements.
Line Regulation
The change in output voltage for a change in input
voltage. The measurement is made under conditions
of low dissipation or by using pulse techniques such
that average chip temperature is not significantly af-
fected.
Load Regulation
The change in output voltage for a change in load
current at constant chip temperature. The measure-
ment is made under conditions of low dissipation or by
using pulse techniques such that average chip tem-
perature is not significantly affected.
Maximum Power Dissipation
The maximum total device dissipation for which the
regulator will operate within specifications.
Quiescent Bias Current
Current which is used to operate the regulator chip
and is not delivered to the load.
Ver: 4.6
Jan 08, 2007
TEL: 886-3-5788833
http://www.gmt.com.tw
2

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