FTR-H3 Просмотр технического описания (PDF) - Fujitsu
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FTR-H3 Datasheet PDF : 7 Pages
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FTFRT-RH-K3 1SSEERRIEIESS
RoHS Compliance and Lead Free Information
1. General Information
l All signal and power relays produced by Fujitsu Components are compliant with RoHS directive 2002/95EC
including amendments.
l Cadmium as used in electrical contacts is exempted from the RoHS directives on October 21st, 2005.
(Amendment to Directive 2002/95/EC)
l All of our signal and power relays are lead-free. Please refer to Lead-Free Status Info for older date codes
at: http://www.fujitsu.com/us/downloads/MICRO/fcai/relays/lead-free-letter.pdf
l Lead free solder plating on relay terminals is Sn-3.0Ag-0.5Cu, unless otherwise specified.
This material has been verified to be compatible with PbSn assembly process.
2. Recommended Lead Free Solder Profile
l Recommended solder Sn-3.0Ag-0.5Cu.
Flow Solder condition:
Pre-heating: maximum 120˚C
Soldering:
dip within 5 sec. at
260˚C solder bath
Solder by Soldering Iron:
Soldering Iron
Temperature: maximum 360˚C
Duration:
maximum 3 sec.
We highly recommend that you confirm your actual solder conditions
3. Moisture Sensitivity
l Moisture Sensitivity Level standard is not applicable to electromechanical relays, unless otherwise indicated.
4. Tin Whiskers
l Dipped SnAgCu solder is known as presenting a low risk to tin whisker development. No considerable length
whisker was found by our in house test.
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