FOD617B3SD Просмотр технического описания (PDF) - Fairchild Semiconductor

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Компоненты Описание

производитель

FOD617B3SD

4-Pin Phototransistor Optocouplers

Fairchild Semiconductor 

Package Dimensions (Through Hole) Package Dimensions (Surface Mount)

0.200 (5.10)

0.161 (4.10)

0.157 (4.00)

0.118 (3.00)

0.130 (3.30)

0.091 (2.30)

0.150 (3.80)

0.110 (2.80)

0.110 (2.79)

0.090 (2.29)

0.020 (0.51)

TYP

0.024 (0.60)

0.016 (0.40)

0.312 (7.92)

0.288 (7.32)

0.276 (7.00)

0.236 (6.00)

0.300 (7.62)

typ

0.010 (0.26)

0.200 (5.10)

0.161 (4.10)

0.157 (4.00)

0.118 (3.00)

0.051 (1.30)

0.043 (1.10)

0.024 (0.60)

0.004 (0.10)

0.110 (2.79)

0.090 (2.29)

Lead Coplanarity 0.004 (0.10) MAX

0.312 (7.92)

0.288 (7.32)

0.276 (7.00)

0.236 (6.00)

0.049 (1.25)

0.030 (0.76)

0.412 (10.46)

0.388 (9.86)

0.010 (0.26)

Package Dimensions

(0.4” Lead Spacing)

0.200 (5.10)

0.161 (4.10)

0.157 (4.00)

0.118 (3.00)

0.312 (7.92)

0.288 (7.32)

0.276 (7.00)

0.236 (6.00)

0.130 (3.30)

0.091 (2.30)

0.150 (3.80)

0.110 (2.80)

0.024 (0.60)

0.016 (0.40)

0.110 (2.79)

0.090 (2.29)

0.110 (2.80)

0.011 (1.80)

0.42 (10.66)

0.38 (9.66)

0.291 (7.40)

0.252 (6.40)

0.010 (0.26)

Footprint Dimensions

(Surface Mount)

1.5

1.3

9

2.54

NOTE

All dimensions are in inches (millimeters)

8

FOD814 Series, FOD617 Series, FOD817 Series Rev. 1.0.2

www.fairchildsemi.com

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