FDC6323L Просмотр технического описания (PDF) - Fairchild Semiconductor

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производитель

FDC6323L

Integrated Load Switch

Fairchild Semiconductor 

Electrical Characteristics (TA = 25°C unless otherwise noted)

Symbol Parameter

Conditions

Min Typ Max Units

OFF CHARACTERISTICS

IFL

Forward Leakage Current

IRL

Reverse Leakage Current

ON CHARACTERISTICS (Note 3)

VIN = 8 V, VON/OFF = 0 V

VIN = -8 V, VON/OFF = 0 V

1

µA

-1

µA

VIN

VON/OFF

VDROP

IL

Input Voltage

On/Off Voltage

Conduction Voltage Drop @ 1A

Load Current

VIN = 5 V, VON/OFF = 3.3 V

VIN = 3.3 V, VON/OFF = 3.3 V

VDROP = 0.2 V, VIN = 5 V, VON/OFF = 3.3 V

VDROP = 0.3 V, VIN = 3.3 V, VON/OFF = 3.3 V

3

8

V

1.5

8

V

0.145 0.2

V

0.178 0.3

1

A

1

Notes:

1. VIN=8V, VON/OFF=8V, VDROP=0.5V, TA=25oC

2. RθJA is the sum of the junction-to-case and case-to-ambient thermal resistance where the case thermal reference is defined as the solder mounting surface of the drain pins. RθJC is guaranteed

by design while RθCA is determined by the user's board design.

( ) = = = ( ) × PD t

TJ −TA

RθJ A(t)

TJ −TA

RθJ C+RθCA(t)

I

2

D

t

RDS(ON)@TJ

Typical RθJA for single device operation using the board layouts shown below on FR-4 PCB in a still air environment:

a. 180oC/W when mounted on a 2oz minimum copper pad.

2a

Scale 1 : 1 on letter size paper

3. Pulse Test: Pulse Width < 300µs, Duty Cycle < 2.0%

FDC6323L Rev.F

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