FAN5701 Просмотр технического описания (PDF) - Fairchild Semiconductor
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Компоненты Описание
производитель
FAN5701 Datasheet PDF : 12 Pages
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Physical Dimensions
0.03 C
2X
E
AF
B
BALL A1
INDEX AREA
D
0.03 C
2X
TOP VIEW
0.05 C
0.06 C
0.625
0.547
E
0.40
(Ø0.20)
A1
Cu Pad
0.40
(Ø0.30) Solder
Mask Opening
RECOMMENDED LAND PATTERN
(NSMD PAD TYPE)
0.378±0.018
0.208±0.021
C
SEATING
PLANE D
SIDE VIEWS
0.40
0.40
1234
0.005 C A B
Ø0.260±0.02
16X
D
C
B (Y) ±0.018
A
F
(X) ±0.018
BOTTOM VIEW
NOTES:
A. NO JEDEC REGISTRATION APPLIES.
B. DIMENSIONS ARE IN MILLIMETERS.
C. DIMENSIONS AND TOLERANCE
PER ASME Y14.5M, 1994.
D. DATUM C IS DEFINED BY THE SPHERICAL
CROWNS OF THE BALLS.
E. PACKAGE NOMINAL HEIGHT IS 586 MICRONS
±39 MICRONS (547-625 MICRONS).
F. FOR DIMENSIONS D, E, X, AND Y SEE
PRODUCT DATASHEET.
G. DRAWING FILNAME: MKT-UC016AArev2.
Figure 16. Wafer-Level Chip-Scale Package (WLCSP)
Product-Specific Dimensions
Product
D
FAN5701UCxx
1.610mm
E
1.610mm
X
0.205mm
Y
0.205mm
Package drawings are provided as a service to customers considering Fairchild components. Drawings may change in any manner without
notice. Please note the revision and/or date on the drawing and contact a Fairchild Semiconductor representative to verify or obtain the most
recent revision. Package specifications do not expand the terms of Fairchild’s worldwide terms and conditions, specifically the warranty therein, which
covers Fairchild products.
Always visit Fairchild Semiconductor’s online packaging area for the most recent package drawings:
http://www.fairchildsemi.com/packaging/.
© 2009 Fairchild Semiconductor Corporation
FAN5701 • Rev. 1.0.3
10
www.fairchildsemi.com
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