ESDALC6V1-5P6 Просмотр технического описания (PDF) - STMicroelectronics
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ESDALC6V1-5P6 Datasheet PDF : 8 Pages
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Package information
4
Package information
ESDALC6V1-5P6
● Epoxy meets UL 94, V0
In order to meet environmental requirements, ST offers these devices in ECOPACK®
packages. These packages have a lead-free second level interconnect. The category of
second level interconnect is marked on the package and on the inner box label, in
compliance with JEDEC Standard JESD97. The maximum ratings related to soldering
conditions are also marked on the inner box label. ECOPACK is an ST trademark.
ECOPACK specifications are available at: www.st.com.
Table 3. SOT666 dimensions
b1
L1
L3
b
D
E1
A
E
e
L2
A3
Dimensions
Ref.
Millimeters
Inches
Min. Typ. Max. Min. Typ. Max.
A 0.45
0.60 0.018
0.024
A3 0.08
0.18 0.003
0.007
b 0.17
0.34 0.007
0.013
b1 0.19 0.27 0.34 0.007 0.011 0.013
D 1.50
1.70 0.059
0.067
E 1.50
1.70 0.059
0.067
E1 1.10
1.30 0.043
0.051
e
0.50
0.020
L1
0.19
0.007
L2 0.10
0.30 0.004
0.012
L3
0.10
0.004
Figure 14. SOT666 footprint (dimensions in mm)
0.50
0.62 2.60
0.99
0.30
6/8
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