ESDALC6V1-1M2 Просмотр технического описания (PDF) - STMicroelectronics

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ESDALC6V1-1M2

Single line low capacitance Transil™, transient surge voltage suppressor (TVS) for ESD protection

STMicroelectronics 

Recommendation on PCB assembly

4

Recommendation on PCB assembly

ESDALC6V1-1M2

4.1

Stencil opening design

1. General recommendation on stencil opening design

a) Stencil opening dimensions: L (Length), W (Width), T (Thickness).

Figure 17. Stencil opening dimensions

L

TW

b) General design rule

Stencil thickness (T) = 75 ~ 125 µm

Aspect

Ratio

=

W-----

T

≥ 1.5

Aspect Area = 2----T---L-(---L-×---+-W----W-------) ≥ 0.66

2. Reference design

a) Stencil opening thickness: 100 µm

b) Stencil opening for leads: Opening to footprint ratio - between 60% and 65%.

Figure 18. Recommended stencil windows position

Package footprint

Lead footprint on PCB

0.055 mm

Lead footprint on PCB

Stencil window

position

0.39 mm

Stencil window

position

0.45 mm

0.05 mm

0.05 mm

4.2

Solder paste

1. Halide-free flux qualification ROL0 according to ANSI/J-STD-004.

2. “No clean” solder paste is recommended.

3. Offers a high tack force to resist component movement during high speed.

4. Solder paste with fine particles: powder particle size is 20-45 µm.

8/11

Doc ID 12385 Rev 7

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