ESDA14V2-4BF3 Просмотр технического описания (PDF) - STMicroelectronics
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ESDA14V2-4BF3 Datasheet PDF : 8 Pages
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Ordering information
Figure 13. Footprint
Copper pad Diameter:
220 µm recommended
260 µm maximum
Solder mask opening:
300 µm minimum
Solder stencil opening:
220 µm recommended
ESDA14V2-4BF3
Figure 14. Marking
Dot
xx = marking
z = manufacturing location
yww = datecode
(y = year
ww = week)
xxz
y ww
Figure 15. Flip Chip tape and reel specifications
Dot identifying Pin A1 location
4 ± 0.1
Ø 1.5 ± 0.1
1.04
0.69 ± 0.05
4 ± 0.1
Note:
All dimensions in mm
User direction of unreeling
More information is available in the application notes:
AN2348:"400 µm Flip Chip: Package description and recommendations for use"
AN1751: EMI Filters: Recommendations and measurements
5
Ordering information
Table 3. Ordering information
Order code
Marking
ESDA14V2-4BF3
EF
Package
Flip Chip
Weight
1.10 mg
Base qty Delivery mode
5000 Tape and reel 7”
6/8
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