ESDA14V2-4BF3(2010) Просмотр технического описания (PDF) - STMicroelectronics

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Компоненты Описание

производитель

ESDA14V2-4BF3
(Rev.:2010)

Quad bidirectional Transil™ array for ESD protection

STMicroelectronics 

ESDA14V2-4BF3

5

Ordering information

Ordering information

Table 3. Ordering information

Order code

Marking

ESDA14V2-4BF3

EF

Package

Flip Chip

Weight

1.10 mg

Base qty Delivery mode

5000 Tape and reel 7”

6

Revision history

Table 4. Document revision history

Date

Revision

Changes

19-Sep-2005

15-Dec-2005

18-Apr-2008

28-Jan-2010

1

Initial release.

Dimension from center bump to corner bump changed in Figure 9 to

2

indicate diagonal instead of perpendicular measurement. No values

changed. ECOPACK statement added. Updated ordering information.

3

Updated ECOPACK statement. Updated Figure 11, Figure 12 and

Figure 15. Reformatted to current standards.

4

Added ST logo and ECOPACK grade to package and marking

illustrations.

Doc ID 11645 Rev 4

7/8

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