ESDA14V2-4BF3(2010) Просмотр технического описания (PDF) - STMicroelectronics

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производитель

ESDA14V2-4BF3
(Rev.:2010)

Quad bidirectional Transil™ array for ESD protection

STMicroelectronics 

Package information

Figure 13. Footprint

Copper pad Diameter:

220 µm recommended

260 µm maximum

Solder mask opening:

300 µm minimum

Solder stencil opening:

220 µm recommended

Figure 14. Marking

Dot

xx = marking

z = manufacturing location

yww = datecode

(y = year

ww = week)

ECOPACK grade

ESDA14V2-4BF3

xxz

y ww

Figure 15. Flip Chip tape and reel specifications

Dot identifying Pin A1 location

4.0 ± 0.1

Ø 1.5 ± 0.1

Note:

0.69 ± 0.05

1.04

4.0 ± 0.1

All dimensions in mm

User direction of unreeling

More information is available in the application notes:

AN2348:"400 µm Flip Chip: Package description and recommendations for use"

AN1751: EMI Filters: Recommendations and measurements

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Doc ID 11645 Rev 4

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