ESD11N5.0ST5G(2017) Просмотр технического описания (PDF) - ON Semiconductor

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ESD11N5.0ST5G
(Rev.:2017)

ESD Protection Diodes Micro−Packaged Diodes for ESD Protection

ON Semiconductor 

ESD11N5.0ST5G

ESD Protection Diodes

Micro−Packaged Diodes for ESD Protection

The ESD11N is designed to protect voltage sensitive components

that require ultra−low capacitance from ESD and transient voltage

events. Excellent clamping capability, low capacitance, low leakage,

and fast response time, make these parts ideal for ESD protection on

designs where board space is at a premium. Because of its low

capacitance, it is suited for use in high frequency designs such as USB

2.0 high speed and antenna line applications.

Specification Features

• Low Capacitance 0.6 pF

• Low Clamping Voltage

• Small Body Outline Dimensions: 0.60 mm x 0.30 mm

• Low Body Height: 0.3 mm

• Stand−off Voltage: 5.0 V

• Low Leakage

• Response Time is < 1 ns

• IEC61000−4−2 Level 4 ESD Protection

• These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS

Compliant

Mechanical Characteristics

MOUNTING POSITION: Any

QUALIFIED MAX REFLOW TEMPERATURE: 260°C

Device Meets MSL 1 Requirements

MAXIMUM RATINGS

Rating

Symbol

Value

Unit

IEC 61000−4−2 (ESD)

Contact

Air

±8.0

kV

±15

Total Power Dissipation on FR−5 Board

(Note 1) @ TA = 25°C

Thermal Resistance, Junction−to−Ambient

Junction and Storage Temperature Range

Lead Solder Temperature − Maximum

(10 Second Duration)

°PD°

RqJA

TJ, Tstg

TL

250

mW

400

°C/W

−40 to +125 °C

260

°C

Stresses exceeding those listed in the Maximum Ratings table may damage the

device. If any of these limits are exceeded, device functionality should not be

assumed, damage may occur and reliability may be affected.

1. FR−5 = 1.0 x 0.75 x 0.62 in.

www.onsemi.com

DSN2

CASE 152AA

MARKING

DIAGRAM

PIN 1

XXXX

YYY

XXXX = Specific Device Code

YYY = Year Code

ORDERING INFORMATION

Device

Package

Shipping†

ESD11N5.0ST5G DSN2 5000/Tape & Reel

(Pb−Free)

†For information on tape and reel specifications,

including part orientation and tape sizes, please

refer to our Tape and Reel Packaging Specifications

Brochure, BRD8011/D.

See Application Note AND8308/D for further description of survivability specs.

© Semiconductor Components Industries, LLC, 2010

1

November, 2017 − Rev. 5

Publication Order Number:

ESD11N5.0S/D

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