AD7305BR(RevA) Просмотр технического описания (PDF) - Analog Devices
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AD7305BR Datasheet PDF : 14 Pages
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AD7304/AD7305
TIMING SPECIFICATIONS (@ VDD = +3 V or +5 V, VSS = 0 V; or VDD = +5 V and VSS = –5 V, VSS ≤ VREF ≤ VDD, –40؇C < TA <
+85؇C/125؇C, unless otherwise noted.)
Parameter
Symbol
3 V ؎ 10%
5 V ؎ 10%
؎5 V ؎ 10%
Units
INTERFACE TIMING SPECIFICATIONS1, 2
AD7304 Only
Clock Width High
tCH
70
55
55
ns min
Clock Width Low
tCL
70
55
55
ns min
Data Setup
tDS
50
40
40
ns min
Data Hold
tDH
30
20
20
ns min
Load Pulsewidth
tLDW
70
60
60
ns min
Load Setup
tLD1
40
30
30
ns min
Load Hold
tLD2
40
30
30
ns min
Clear Pulsewidth
tCLWR
60
60
60
ns min
Select
tCSS
30
20
20
ns min
Deselect
tCSH
60
40
40
ns min
AD7305 Only
Data Setup
tDS
60
40
40
ns min
Data Hold
tDH
30
20
20
ns min
Address Setup
tAS
60
40
40
ns min
Address Hold
tAH
30
20
20
ns min
Write Width
tWR
60
50
50
ns min
Load Pulsewidth
tLDW
60
50
50
ns min
Load Setup
tLS
60
40
40
ns min
Load Hold
tLH
30
20
20
ns min
NOTES
1These parameters are guaranteed by design and not subject to production testing.
2All input control signals are specified with tR = tF = 2 ns (10% to 90% of VDD) and timed from a voltage level of 1.6 V.
ABSOLUTE MAXIMUM RATINGS*
VDD to GND . . . . . . . . . . . . . . . . . . . . . . . . . . . . –0.3 V, +8 V
VSS to GND . . . . . . . . . . . . . . . . . . . . . . . . . . . . . +0.3 V, –8 V
VREFX to GND . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . VSS, VDD
Logic Inputs to GND . . . . . . . . . . . . . . . –0.3 V, VDD + 0.3 V
VOUTX to GND . . . . . . . . . . . . . . . . . . . . –0.3 V, VDD + 0.3 V
IOUT Short Circuit to GND . . . . . . . . . . . . . . . . . . . . . 50 mA
Package Power Dissipation . . . . . . . . . . . . . . (TJ MAX–TA)/θJA
Thermal Resistance θJA
16-Lead Plastic DIP Package (N-16) . . . . . . . . . . 103°C/W
16-Lead SOIC Package (R-16) . . . . . . . . . . . . . . . 73°C/W
TSSOP-16 Package (RU-16) . . . . . . . . . . . . . . . . 180°C/W
20-Lead Plastic DIP Package (N-20) . . . . . . . . . . 120°C/W
20-Lead SOIC Package (R-20) . . . . . . . . . . . . . . . 74°C/W
TSSOP-20 Package (RU-20) . . . . . . . . . . . . . . . . 155°C/W
Maximum Junction Temperature (TJ MAX) . . . . . . . . . +150°C
Operating Temperature Range . . . . . . . . . . . –40°C to +85°C
Storage Temperature Range . . . . . . . . . . . . –65°C to +150°C
Lead Temperature
N-16 and N-20 (Soldering, 10 secs) . . . . . . . . . . . . +300°C
R-16, R-20, RU-16, RU-20 (Vapor Phase, 60 secs) . . +215°C
R-16, R-20, RU-16, RU-20 (Infrared, 15 secs) . . . . +220°C
ORDERING GUIDE
Model
Temperature Package
Range
Description
Package
Options
AD7304BN
AD7304BR
AD7304YR
AD7304BRU
–40°C/+85°C
–40°C/+85°C
–40°C/+125°C
–40°C/+85°C
16-Lead P-DIP
16-Lead SOIC
16-Lead SOIC
TSSOP-16
N-16
R-16
R-16
RU-16
AD7305BN
AD7305BR
AD7305YR
AD7305BRU
–40°C/+85°C
–40°C/+85°C
–40°C/+125°C
–40°C/+85°C
20-Lead P-DIP
20-Lead SOIC
20-Lead SOIC
TSSOP-20
N-20
R-20
R-20
RU-20
The AD7304/AD7305 contains 2759 transistors. Die size: 103 mil × 102 mil,
10,506 sq mil.
*Stresses above those listed under Absolute Maximum Ratings may cause perma-
nent damage to the device. This is a stress rating only; functional operation of the
device at these or any other conditions above those indicated in the operational
sections of this specification is not implied. Exposure to absolute maximum rating
conditions for extended periods may affect device reliability.
CAUTION
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily
accumulate on the human body and test equipment and can discharge without detection.
Although the AD7304/AD7305 features proprietary ESD protection circuitry, permanent dam-
age may occur on devices subjected to high energy electrostatic discharges. Therefore, proper
ESD precautions are recommended to avoid performance degradation or loss of functionality.
WARNING!
ESD SENSITIVE DEVICE
REV. A
–3–
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