EMIF08-LCD04M16 Просмотр технического описания (PDF) - STMicroelectronics
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EMIF08-LCD04M16 Datasheet PDF : 10 Pages
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Recommendation on PCB assembly
4
Recommendation on PCB assembly
EMIF08-LCD04M16
4.1
Stencil opening design
1. General recommendation on stencil opening design
a) Stencil opening dimensions: L (Length), W (Width), T (Thickness).
Figure 11. Stencil opening dimensions
L
TW
b) General design rule
Stencil thickness (T) = 75 ~ 125 µm
Aspect
Ratio
=
W-----
T
≥ 1.5
Aspect Area = 2----T---L-(---L-×---+-W----W-------) ≥ 0.66
2. Reference design
a) Stencil opening thickness: 100 µm
b) Stencil opening for central exposed pad: Opening to footprint ratio is 50%.
c) Stencil opening for leads: Opening to footprint ratio is 90%.
Figure 12. Recommended stencil window position
4 µm
4 µm
14 µm
T=100 µm
6/10
400 µm
400 µm
192 µm
14
200 µm
2800 µm
µm
60 µm
2000 µm
60 µm
400 µm
Footprint
Stencil window
Footprint
Doc ID 15673 Rev 2
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