EMIF08-1005M16(2008) Просмотр технического описания (PDF) - STMicroelectronics

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производитель

EMIF08-1005M16
(Rev.:2008)

8-line IPAD™ low capacitance EMI filter and ESD protection in micro QFN package

STMicroelectronics 

EMIF08-1005M16

Ordering information

4.5

Reflow profile

Figure 14. ST ECOPACK® recommended soldering reflow profile for PCB mounting

Temperature (°C)

260°C max

255°C

220°C

180°C

125 °C

3°C/s max

3°C/s max

2°C/s62r°°eCCc//ossm6mr°emCacx/eosnmmdmeadxended

0

0

1

2

3

4

5

6

7

10-30 sec

Time (min)

90 to 150 sec

90 sec max

Note:

Minimize air convection currents in the reflow oven to avoid component movement.

5

Ordering information

Table 4. Ordering information

Part number

Marking Package

Weight

EMIF08-1005M16

H8(1)

Micro QFN

7.2 mg

1. The marking can be rotated by 90° to differentiate assembly location

Base qty

3000

Delivery mode

Tape and reel (7”)

6

Revision history

Table 5. Document revision history

Date

Revision

Changes

24-Oct-2006

1

Initial release.

04-Feb-2008

2

Reformatted to current standards. Updated ECOPACK statement.

Added Section 4: Recommendation on PCB assembly.

9/10

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