EMIF04-MMCXF2 Просмотр технического описания (PDF) - STMicroelectronics

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Компоненты Описание

производитель

EMIF04-MMCXF2

4-line IPAD™, EMI filter including ESD protection

STMicroelectronics 

Ordering information

Figure 12. Footprint

Copper pad Diameter:

250 µm recommended, 300 µm max

Solder stencil opening: 330 µm

Solder mask opening recommendation:

340 µm min for 315 µm copper pad diameter

EMIF04-MMC02F2

Figure 13. Marking

Dot, ST logo

xx = marking

z = manufacturing location

yww = datecode

(y = year

ww = week)

E

xxz

y ww

Figure 14. Flip Chip tape and reel specification

Dot identifying Pin A1 location

4 ± 0.1

Ø 1.5 ± 0.1

2.17

0.73 ± 0.05

All dimensions in mm

4 ± 0.1

User direction of unreeling

5

Note:

Ordering information

Table 3. Ordering information

Order code

Marking Package

EMIF04-MMC02F2

FH

Flip Chip

Weight

4.5 mg

Base qty

5000

Delivery mode

Tape and reel (7”)

More packing information is available in the applications note:

AN1235: “Flip Chip: package description and recommendations for use”

AN 1751: “EMI filters: Recomendations and measurements”

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