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EMIF04-EAR02M8(2009) Просмотр технического описания (PDF) - STMicroelectronics

Номер в каталоге
Компоненты Описание
производитель
EMIF04-EAR02M8
(Rev.:2009)
ST-Microelectronics
STMicroelectronics ST-Microelectronics
EMIF04-EAR02M8 Datasheet PDF : 12 Pages
1 2 3 4 5 6 7 8 9 10 Next Last
Recommendation on PCB assembly
EMIF04-EAR02M8
5.5
Reflow profile
Figure 22. ST ECOPACK® recommended soldering reflow profile for PCB mounting
Temperature (°C)
260°C max
255°C
220°C
180°C
125 °C
3°C/s max
3°C/s max
2°C/s62r°°eCCc//ossm6mr°emCacx/eosnmmdmeadxended
Note:
0
0
1
2
3
4
5
6
7
10-30 sec
Time (min)
90 to 150 sec
90 sec max
Minimize air convection currents in the reflow oven to avoid component movement.
10/12

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