EMIF09-SD01F3(2006) Просмотр технического описания (PDF) - STMicroelectronics

Номер в каталоге

Компоненты Описание

производитель

EMIF09-SD01F3
(Rev.:2006)

IPAD™ 9 line EMI filter and ESD protection

STMicroelectronics 

3 Package information

3 Package information

Figure 10. Mechanical data

400 µm ± 40

255 µm± 40

EMIF09-SD01F3

605 µm ± 55

1.97 mm ± 30 µm

Figure 11. Foot print recommendations

Copper pad Diameter:

220 µm recommended

260 µm maximum

Solder mask opening:

300 µm minimum

Solder stencil opening :

220 µm recommended

Figure 12. Marking

Dot, ST logo

xx = marking

z = manufacturing location

yww = datecode

(y = year

ww = week)

E

xxz

y ww

Figure 13. Flip-chip tape and reel specifications

Dot identifying Pin A1 location

4 +/- 0.1

Ø 1.5 +/- 0.1

2.11

6/8

0.69 +/- 0.05

All dimensions in mm

4 +/- 0.1

User direction of unreeling

Share Link: