DatasheetQ Logo
Electronic component search and free download site. Transistors,MosFET ,Diode,Integrated circuits

EMIF09-SD01F3(2006) Просмотр технического описания (PDF) - STMicroelectronics

Номер в каталоге
Компоненты Описание
производитель
EMIF09-SD01F3
(Rev.:2006)
ST-Microelectronics
STMicroelectronics ST-Microelectronics
EMIF09-SD01F3 Datasheet PDF : 8 Pages
1 2 3 4 5 6 7 8
EMIF09-SD01F3
2 Ordering information scheme
Figure 8. Aplac model
Lbump Rbump
data0
MODEL = D1
MODEL = D3
Rline
Rsub
Rbump Lbump sddata0
MODEL = D2
MODEL = D4
Rbump
Lbump
Rgnd
Lgnd
Rbump
Lbump
Rbump
Lbump
Rgnd
Lgnd
Rgnd
Lgnd
Figure 9.
Aplac model variables
Variables
aplacvar Rline 40
aplacvar C_d1 14.5p
aplacvar C_d2 6.5p
aplacvar C_d3 303p
aplacvar C_d4 14.5p
aplacvar Lbump 43pH
aplacvar Rbump 17m
aplacvar Cbump 150f
aplacvar Lgnd 150pH
aplacvar Rgnd 10m
aplacvar Rsub 5
Diode D1
BV=7
IBV=1m
CJO=C_d1
M=0.28
RS=1.13
VJ=0.6
TT=100n
Diode D2
BV=7
IBV=1m
CJO=C_d2
M=0.28
RS=0.8
VJ=0.6
TT=100n
Diode D3
BV=7
IBV=1m
CJO=C_d3
M=0.28
RS=0.37
VJ=0.6
TT=100n
Diode D4
BV=7
IBV=1m
CJO=C_d4
M=0.28
RS=1.13
VJ=0.6
TT=100n
2 Ordering information scheme
EMIF yy - xx zz F3
EMI Filter
Number of lines
Information
x = resistance value (Ohms)
z = capacitance value / 10(pF)
or
2 letters = application
2 digits = version
Package
F = Flip-Chip
3 = Lead free Pitch = 400µm, Bump = 260µm
5/8

Share Link: 

datasheetq.com  [ Privacy Policy ]Request Datasheet ] [ Contact Us ]