EMIF02-SPK01C2 Просмотр технического описания (PDF) - STMicroelectronics
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EMIF02-SPK01C2 Datasheet PDF : 7 Pages
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Ordering information
Figure 12. Flip-Chip tape and reel specification
Dot identifying Pin A1 location
4 ± 0.1
EMIF02-SPK01C2
Ø 1.5 ± 0.1
ST E
xxz
yww
ST E
xxz
yww
ST E
xxz
yww
0.73 ± 0.05
4 ± 0.1
All dimensions in mm
User direction of unreeling
In order to meet environmental requirements, ST offers these devices in ECOPACK®
packages. These packages have a lead-free second level interconnect. The category of
second level interconnect is marked on the inner box label, in compliance with JEDEC
Standard JESD97. The maximum ratings related to soldering conditions are also marked on
the inner box label. ECOPACK is an ST trademark. ECOPACK specifications are available
at: www.st.com.
4
Ordering information
Ordering code Marking
EMIF02-SPK01C2 FX
Package
Flip-Chip
Weight
2.3 mg
Base qty
5000
Delivery mode
7” Tape and reel
5
Revision history
Date
26-Jan-2006
Revision
1
Initial release.
Changes
6/7
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