EMIF02-1003M6 Просмотр технического описания (PDF) - STMicroelectronics
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EMIF02-1003M6 Datasheet PDF : 10 Pages
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EMIF02-1003M6
4
Package information
Package information
● Epoxy meets UL94, V0
In order to meet environmental requirements, ST offers these devices in ECOPACK®
packages. These packages have a lead-free second level interconnect. The category of
second level interconnect is marked on the package and on the inner box label, in
compliance with JEDEC Standard JESD97. The maximum ratings related to soldering
conditions are also marked on the inner box label. ECOPACK is an ST trademark.
ECOPACK specifications are available at: www.st.com.
Table 3. Micro QFN 1.45 x 1.00 6L dimensions
D
N
E
12
Dimensions
Ref.
Millimeters
Inches
Min. Typ. Max. Min. Typ. Max.
A 0.50 0.55 0.60 0.020 0.022 0.024
A
A1
12
e
L
k
b
A1 0.00 0.02 0.05 0.000 0.001 0.002
b 0.18 0.25 0.30 0.007 0.010 0.012
D
1.45
0.057
E
1.00
0.039
e
0.50
0.020
K 0.20
0.008
L 0.30 0.35 0.40 0.012 0.014 0.016
Figure 10. Footprint in mm [inches]
0.50
[0.020]
0.25
[0.010]
Figure 11. Marking
Dot : Pi n 1 Identification
XX = Marking
0.60
[0.023]
0.30 1.60
F
[0.012] [0.063]
5/10
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