EMIF01-TV01F3 Просмотр технического описания (PDF) - STMicroelectronics
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производитель
EMIF01-TV01F3 Datasheet PDF : 8 Pages
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Ordering information
Figure 11. Footprint
Copper pad Diameter:
220 µm recommended
260 µm maximum
Solder mask opening:
300 µm minimum
Solder stencil opening :
220 µm recommended
EMIF01-TV01F3
Figure 12. Marking
Dot
xx = marking
z = manufacturing location
yww = datecode
(y = year
ww = week)
xxz
y ww
Figure 13. Flip Chip tape and reel specification
Dot identifying Pin A1 location
4 ± 0.1
Ø 1.5 ± 0.1
0.87
Note:
0.71 ± 0.05
4 ± 0.1
All dimensions in mm
User direction of unreeling
More information is available in the application notes:
AN2348: “STMicroelectronics 400 micro-metre Flip Chip: Package description and
recommendation for use”
AN1751: “EMI filters: Recommendations and measurements”
5
Ordering information
Table 3. Ordering information
Order code
Marking
Package
EMIF01-TV01F3
HC
Flip Chip
Weight
0.79 mg
Base qty
5000
Delivery mode
Tape and reel 7”
6/8
Doc ID 12078 Rev 3
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