EMIF01-1003M3(2007) Просмотр технического описания (PDF) - STMicroelectronics

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Компоненты Описание

производитель

EMIF01-1003M3
(Rev.:2007)

1 line IPAD™, EMI filter and ESD protection in Micro QFN package

STMicroelectronics 

EMIF01-1003M3

Recommendation on PCB assembly

5

Recommendation on PCB assembly

5.1

Stencil opening design

1. General recommendation on stencil opening design

a) Stencil opening dimensions: L (Length), W (Width), T (Thickness).

Figure 12. Stencil opening dimensions

L

TW

b) General Design Rule

Stencil thickness (T) = 75 ~ 125 µm

Aspect Ratio

=

W-----

T

≥

1.5

Aspect Area

=

-------L-----×-----W----------

2T(L + W)

≥

0.66

2. Reference design

a) Stencil opening thickness: 100 µm

b) Stencil opening for leads: Opening to footprint ratio is 90%.

5.2

Solder paste

1. Halide-free flux qualification ROL0 according to ANSI/J-STD-004.

2. “No clean” solder paste is recommended.

3. Offers a high tack force to resist component movement during high speed

4. Solder paste with fine particles: powder particle size is 20-45 µm.

7/10

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