EL5224IRE-T7 Просмотр технического описания (PDF) - Intersil

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Компоненты Описание

производитель

EL5224IRE-T7

12MHz Rail-to-Rail Buffers + 100mA VCOM Amplifier

Intersil 

EL5224, EL5324, EL5424

Typical Performance Curves (Continued)

M=4µs/DIV, VS=±7.5V, VIN=0V

0mA

-100mA

100mA/DIV

M=4µs/DIV, VS=±7.5V, VIN=0V

100mA

0mA

0V

CL=1µF

20mV/DIV

0V

CL=1µF

100mA/DIV

20mV/DIV

FIGURE 13. TRANSIENT LOAD REGULATION - SOURCING

(VCOM)

VS=±7.5V, RL=10kΩ, CL=12pF

FIGURE 14. TRANSIENT LOAD REGULATION - SINKING

(VCOM)

VS=±7.5V

50mV/DIV

1V/DIV

200ns/DIV

FIGURE 15. SMALL SIGNAL TRANSIENT RESPONSE

(BUFFER)

JEDEC JESD51-7 HIGH EFFECTIVE THERMAL

CONDUCTIVITY (4-LAYER) TEST BOARD, QFN EXPOSED

DIEPAD SOLDERED TO PCB PER JESD51-5

3

2.857W

2.5 2.703W

QFN32

2

θJA=35°C/W

1.5

QFN24

θJA=37°C/W

1

0.5

0

0

25

50

75 85 100 125 150

AMBIENT TEMPERATURE (°C)

FIGURE 17. PACKAGE POWER DISSIPATION vs AMBIENT

TEMPERATURE

7

1µs/DIV

FIGURE 16. LARGE SIGNAL TRANSIENT RESPONSE

(BUFFER)

JEDEC JESD51-3 AND SEMI G42-88 (SINGLE

LAYER) TEST BOARD

0.8

758mW

0.7

714mW

0.6

QFN32

0.5

θJA=132°C/W

0.4

QFN24

θJA=140°C/W

0.3

0.2

0.1

0

0

25

50

75 85 100 125 150

AMBIENT TEMPERATURE (°C)

FIGURE 18. PACKAGE POWER DISSIPATION vs AMBIENT

TEMPERATURE

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