EK13 Просмотр технического описания (PDF) - Apex Microtechnology
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EK13 Datasheet PDF : 2 Pages
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INTRODUCTION
Fast and easy breadboarding of circuits using the PA241DF
IS possible with the EK13 evaluation kit. The amplifier may
be surface mounted directly to the PC board. The PA241DF
is soldered to a 2-square inch area of foil on the PC board for
heat sinking. This foil heat sink is connected to–Vs. Connec-
tions are provided for required power supply bypassing, phase
compensation components, and a current limit resistor. A large
area for component mounting provides flexibility and makes a
multitude of circuit configurations possible.
PARTS LIST
Part #
EVAL15
OX7R105KWN
HS24
Description
PC Board
1µF Ceramic Capacitor
Heatsink
Quantity
1
1
1
ASSEMBLY
The PA241DF is a surface mount device and should be
assembled to the EVAL15 PC board using surface mount
processes. Solder paste may be dispensed or screen-printed
on the DUT pads. The heat tab on the back of the PA241DF
provides maximum heat dissipation capabilities when soldered
to the PCB metalization that runs under the DUT on the DUT
side of the board. Solder should be applied here also. For
prototype purposes, the tab can be thermally connected to the
PCB metalization using thermal grease.
The PA241DF and HS24 should be reflowed to the PCB
using a solder reflow furnace. If this is not available, a heat
plate capable of solder reflow temperatures may be used. or,
though time consuming, the leads may be soldered individually
to the PCB with a soldering iron. In this case the use of thermal
grease under the heat tab is recommended instead of solder
for the thermal connection.
CAUTION High voltages will be present. Use caution in
handling and probing when power is applied.
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APEX MICROTECHNOLOGY CORPORATION • TELEPHONE (520) 690-8600 • FAX (520) 888-3329 • ORDERS (520) 690-8601 • EMAIL prodlit@apexmicrotech.com
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