DTC123TE(2016) Просмотр технического описания (PDF) - ON Semiconductor

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Компоненты Описание

производитель

DTC123TE
(Rev.:2016)

Digital Transistors (BRT) R1 = 2.2 kΩ, R2 = ∞ kΩ

ON Semiconductor 

MUN2238, MMUN2238L, MUN5238, DTC123TE, DTC123TM3, NSBC123TF3

PACKAGE DIMENSIONS

−X−

D

b1

3

−Y−

E

2X e

1

2

2X b

0.08 X Y

TOP VIEW

3X L

1

3X L2

BOTTOM VIEW

SOT−723

CASE 631AA

ISSUE D

A

HE

C

SIDE VIEW

NOTES:

1. DIMENSIONING AND TOLERANCING PER ASME

Y14.5M, 1994.

2. CONTROLLING DIMENSION: MILLIMETERS.

3. MAXIMUM LEAD THICKNESS INCLUDES LEAD

FINISH. MINIMUM LEAD THICKNESS IS THE MINIMUM

THICKNESS OF BASE MATERIAL.

4. DIMENSIONS D AND E DO NOT INCLUDE MOLD

FLASH, PROTRUSIONS OR GATE BURRS.

MILLIMETERS

DIM MIN NOM MAX

A 0.45 0.50 0.55

b 0.15 0.21 0.27

b1 0.25 0.31 0.37

C 0.07 0.12 0.17

D 1.15 1.20 1.25

E 0.75 0.80 0.85

e

0.40 BSC

H E 1.15 1.20 1.25

L

0.29 REF

L2 0.15 0.20 0.25

STYLE 1:

PIN 1. BASE

2. EMITTER

3. COLLECTOR

RECOMMENDED

SOLDERING FOOTPRINT*

2X 0.27

2X

0.40

PACKAGE

OUTLINE

1.50

3X 0.52

0.36

DIMENSIONS: MILLIMETERS

*For additional information on our Pb−Free strategy and soldering

details, please download the ON Semiconductor Soldering and

Mounting Techniques Reference Manual, SOLDERRM/D.

www.onsemi.com

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