H7805BJ Просмотр технического описания (PDF) - Hi-Sincerity Microelectronics
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H7805BJ Datasheet PDF : 12 Pages
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HI-SINCERITY
MICROELECTRONICS CORP.
Spec. No. : IC200405
Issued Date : 2004.04.01
Revised Date : 2006.01.19
Page No. : 10/12
TO-251 Dimension
A
M
Tab
F
C
G
1
2
3
K
H1
K1
a1
L
a1
Marking:
Pb Free Mark
Pb-Free: " . " (Note)
Normal: None
H
78
Product Series
I (05,06,08,09,12)
Date Code
Control Code
Note: Green label is used for pb-free packing
Pin Style: 1.Input 2.Ground 3.Output
Material:
• Lead solder plating: Sn60/Pb40 (Normal),
Sn/3.0Ag/0.5Cu or Pure-Tin (Pb-free)
• Mold Compound: Epoxy resin family,
flammability solid burning class: UL94V-0
DIM Min. Max.
A
6.35 6.80
C
4.80 5.50
F
1.30 1.70
G
5.40 6.25
H1 6.75 8.00
K
0.50 0.90
K1 0.40 0.90
L
0.90 1.50
M
2.20 2.40
a1 0.40 0.65
a2
-
*2.30
*: Typical, Unit: mm
3-Lead TO-251
a2
a2
Plastic Package
HSMC Package Code: I
A
B
C
D
F
a1
y1
E
G
H
y1
J
K
H1
K1
a2
y2
a2
y2
M
a1
I
y1
Marking:
Pb Free Mark
Pb-Free: " . " (Note)
Normal: None
H
78
Product Series
I (05,06,08,09,12)
Date Code
Control Code
Note: Green label is used for pb-free packing
Pin Style: 1.Input 2.Ground 3.Output
Material:
• Lead solder plating: Sn60/Pb40 (Normal),
Sn/3.0Ag/0.5Cu or Pure-Tin (Pb-free)
• Mold Compound: Epoxy resin family,
flammability solid burning class: UL94V-0
a1
3-Lead TO-251
Plastic Package
HSMC Package Code: I
DIM Min. Max.
A
6.40 6.80
B
-
6.00
C
5.04 5.64
D
-
*4.34
E
0.40 0.80
F
0.50 0.90
G
5.90 6.30
H
-
*1.80
H1
-
*9.30
I
- *16.10
J
-
*0.80
K
-
0.96
K1
-
*0.76
M
2.20 2.40
a1 0.40 0.60
a2 2.10 2.50
y1
-
5o
y2
-
3o
*: Typical, Unit: mm
H78XXAJ / BJ, H78XXAI / BI, H78XXANE / BNE, H78XXAE / BE
HSMC Product Specification
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