HGTG15N120C3 Просмотр технического описания (PDF) - Intersil
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HGTG15N120C3 Datasheet PDF : 11 Pages
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HGTG15N120C3, HGTP15N120C3, HGT1S15N120C3, HGT1S15N120C3S
TO-263AB
SURFACE MOUNT JEDEC TO-263AB PLASTIC PACKAGE
E
H1
D
L
1
3
b
e
e1
TERM. 4
L2
b1
A
A1
TERM. 4
L1
c
J1
.450
(11.43)
L3
b2
.700
(17.78)
.350
(8.89)
3
1
.150
(3.81)
.080(2.03)
.080(2.03)
.062(1.58)
.062(1.58)
MINIMUM PAD SIZE RECOMMENDED FOR
SURFACE-MOUNTED APPLICATIONS
LEAD NO. 1
LEAD NO. 3
TERM. 4
- GATE
- EMITTER
- COLLECTOR
INCHES
MILLIMETERS
SYMBOL MIN
MAX
MIN
MAX NOTES
A
0.170
0.180
4.32
4.57
-
A1
0.048
0.052
1.22
1.32
4, 5
b
0.030
0.034
0.77
0.86
4, 5
b1
0.045
0.055
1.15
1.39
4, 5
b2
0.310
-
7.88
-
2
c
0.018
0.022
0.46
0.55
4, 5
D
0.405
0.425 10.29
10.79
-
E
0.395
0.405 10.04
10.28
-
e
0.100 TYP
2.54 TYP
7
e1
0.200 BSC
5.08 BSC
7
H1
0.045
0.055
1.15
1.39
-
J1
0.095
0.105
2.42
2.66
-
L
0.175
0.195
4.45
4.95
-
L1
0.090
0.110
2.29
2.79
4, 6
L2
0.050
0.070
1.27
1.77
3
L3
0.315
-
8.01
-
2
NOTES:
1. These dimensions are within allowable dimensions of Rev. C of
JEDEC TO-263AB outline dated 2-92.
2. L3 and b2 dimensions established a minimum mounting surface
for terminal 4.
3. Solder finish uncontrolled in this area.
4. Dimension (without solder).
5. Add typically 0.002 inches (0.05mm) for solder plating.
6. L1 is the terminal length for soldering.
7. Position of lead to be measured 0.120 inches (3.05mm) from bottom
of dimension D.
8. Controlling dimension: Inch.
9. Revision 7 dated 10-95.
10
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