Die Characteristics
DIE DIMENSIONS:
59 mils x 59 mils x 19 mils
1500µm x 1500µm x 483µm
METALLIZATION:
Type: Metal 1: AICu(2%)/TiW
Thickness: Metal 1: 8kÅ ±0.4kÅ
Type: Metal 2: AICu(2%)
Thickness: Metal 2: 16kÅ ±0.8kÅ
Metallization Mask Layout
-IN
HFA1105
PASSIVATION:
Type: Nitride
Thickness: 4kÅ ±0.5kÅ
TRANSISTOR COUNT:
75
SUBSTRATE POTENTIAL (POWERED UP):
Floating (Recommend Connection to V-)
HFA1105
NC
V+
OUT
+IN
V-
NC
11
FN3395.8
June 6, 2006