DAC1617D1G0HN Просмотр технического описания (PDF) - Integrated Device Technology

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производитель

DAC1617D1G0HN

Dual 16-bit DAC, LVDS interface, up to 1 Gsps, x2, x4 and x8 interpolating

Integrated Device Technology 

Integrated Device Technology

11. Package outline

DAC1617D1G0

Dual 16-bit DAC: up to 1 Gsps; x2, x4 and x8 interpolating

HVQFN72: plastic thermal enhanced very thin quad flat package; no leads;

72 terminals; body 10 x 10 x 0.85 mm

D

BA

SOT813-3

terminal 1

index area

E

A

A1

c

detail X

e

19

L

18

e1

1/2 e b

v

w

36

37

CAB

C

e

Eh

e2

1/2 e

y1 C

C

y

1

54

terminal 1

72

55

index area

Dh

X

Dimensions

0

5

10 mm

scale

Unit

A A1 b

c D(1) Dh E(1) Eh e e1 e2 L

v

w

y y1

max 1.00 0.05 0.30

10.1 7.2 10.1 7.2

0.5

mm nom 0.85 0.02 0.21 0.2 10.0 7.1 10.0 7.1 0.5 8.5 8.5 0.4 0.1 0.05 0.05 0.1

min 0.80 0.00 0.18

9.9 7.0 9.9 7.0

0.3

Note

1. Plastic or metal protrusions of 0.075 mm maximum per side are not included.

Outline

version

References

IEC

JEDEC

JEITA

European

projection

SOT813-3

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---

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Fig 36. Package outline SOT813-3 (HVQFN72)

DAC1617D1G0 3

Preliminary data sheet

Rev. 03 — 2 July 2012

sot813-3_po

Issue date

10-04-02

11-06-20

© IDT 2012. All rights reserved.

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