D2570H881 Просмотр технического описания (PDF) - Agere -> LSI Corporation

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производитель

D2570H881

D2570, D2526, D2555 Wavelength-Selected Direct Modulated Isolated DFB Laser Module

Agere -> LSI Corporation 

Data Sheet, Rev. 3

July 2001

Outline Drawings

Dimensions are in inches and (millimeters).

D2570, D2526G, D2555 Wavelength-Selected

Direct Modulated Isolated DFB Laser Module

0.500 (12.70)

MIN

0.500

(12.70)

0.605

(15.37)

MAX

0.350

(8.89)

0.105 (2.67) DIA

TYP (4) PLACES

1.025 (26.04)

0.020 (0.51) TYP

~

0.100 (2.54) TYP

PIN 1

TRADEMARK, CODE, LASER SERIAL NUMBER,

AND DATE CODE IN APPROX. AREA SHOWN

STRAIN

RELIEF

0.078 (1.98)

PIN 14

0.213 (5.40) TYP

0.10 ± 0.002

(2.54 ± 0.051)

0.036

(0.91)

0.180 (4.56)

0.365

(9.27)

MAX

0.056 (1.42)

0.215 (5.45)

0.820 (20.83)

0.700 (17.78)

2.03 (51.6)

0.863 (21.91)

0.575 (14.61)

39.37 (1000.00)

MIN

0.10

(2.5)

0.260 (6.60)

1.180 (29.97)

HEAT SINK

0.030 (0.75)

0.215

(5.47)

REF

0.200

(5.08)

1-520.g

Agere Systems Inc.

7

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