CY7C1297H-133AXC Просмотр технического описания (PDF) - Cypress Semiconductor
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CY7C1297H-133AXC Datasheet PDF : 15 Pages
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CY7C1297H
Capacitance[9]
Parameter
Description
CIN
CCLK
CI/O
Input Capacitance
Clock Input Capacitance
Input/Output Capacitance
Thermal Resistance[9]
Test Conditions
TA = 25°C, f = 1 MHz,
VDD = 3.3V.
VDDQ = 2.5V
Parameter
Description
ΘJA
Thermal Resistance
(Junction to Ambient)
ΘJC
Thermal Resistance
(Junction to Case)
Test Conditions
Test conditions follow standard test methods and
procedures for measuring thermal impedance, per
EIA/JESD51
AC Test Loads and Waveforms
100 TQFP
Max.
Unit
5
pF
5
pF
5
pF
100 TQFP
Package
30.32
6.85
Unit
°C/W
°C/W
3.3V I/O Test Load
OUTPUT
Z0 = 50Ω
3.3V
OUTPUT
RL = 50Ω
5 pF
VT = 1.5V
(a)
INCLUDING
JIG AND
SCOPE
R = 317Ω
R = 351Ω
(b)
VDDQ
GND
ALL INPUT PULSES
10%
90%
≤ 1 ns
90%
10%
≤ 1 ns
(c)
2.5V I/O Test Load
OUTPUT
Z0 = 50Ω
2.5V
OUTPUT
RL = 50Ω
5 pF
VT = 1.25V
(a)
INCLUDING
JIG AND
SCOPE
R = 1667Ω
R =1538Ω
VDDQ
GND
ALL INPUT PULSES
10%
90%
≤ 1 ns
90%
10%
1 ns
≤
(b)
(c)
Note:
9. Tested initially and after any design or process change that may affect these parameters.
Document #: 38-05669 Rev. *B
Page 8 of 15
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