CXA2093 Просмотр технического описания (PDF) - Sony Semiconductor
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CXA2093 Datasheet PDF : 11 Pages
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Package Outline
Unit: mm
22PIN SDIP (PLASTIC)
+ 0.4
19.2 – 0.1
22
12
1
11
1.778
0˚ to 15˚
CXA2093S
0.5 ± 0.1
+ 0.15
0.9 – 0.1
Two kinds of package surface:
1.All mat surface type.
2.All mirror surface type.
SONY CODE
EIAJ CODE
JEDEC CODE
SDIP-22P-01
SDIP022-P-0300
PACKAGE STRUCTURE
MOLDING COMPOUND EPOXY RESIN
LEAD TREATMENT
SOLDER PLATING
LEAD MATERIAL
COPPER ALLOY
PACKAGE MASS
0.95g
22PIN SDIP (PLASTIC)
+ 0.4
19.2 – 0.1
22
12
1
11
1.778
0˚ to 15˚
0.5 ± 0.1
+ 0.15
0.9 – 0.1
Two kinds of package surface:
1.All mat surface type.
2.All mirror surface type.
SONY CODE
EIAJ CODE
JEDEC CODE
SDIP-22P-01
SDIP022-P-0300
PACKAGE STRUCTURE
MOLDING COMPOUND EPOXY RESIN
LEAD TREATMENT
SOLDER PLATING
LEAD MATERIAL
PACKAGE MASS
COPPER ALLOY
0.95g
LEAD PLATING SPECIFICATIONS
ITEM
LEAD MATERIAL
SOLDER COMPOSITION
PLATING THICKNESS
SPEC.
COPPER ALLOY
Sn-Bi Bi:1-4wt%
5-18µm
– 11 –
Sony Corporation
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