CUS03(2013) Просмотр технического описания (PDF) - Toshiba
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Компоненты Описание
производитель
CUS03 Datasheet PDF : 5 Pages
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iF – vF
10
Tj = 150°C
1
100°C
0.1
75°C
25°C
0.01
0.0
0.2
0.4
0.6
0.8
1.0
1.2
Instantaneous forward voltage vF (V)
CUS03
PF (AV) – IF (AV)
0.5
DC
0.4
180°
120°
0.3
α = 60°
0.2
Rectangular
waveform
0.1
0
0.0
0° α 360°
Conduction
angle: α
0.2
0.4
0.6
0.8
1.0
1.2
Average forward current IF (AV) (A)
Ta max – IF (AV)
160
Device mounted on a ceramic board
(board size: 50 mm × 50 mm,
140
land size: 2 mm × 2 mm)
120
100
80
α = 60° 120°
180°
DC
Rectangular
60
waveform
40
0° α 360°
20 Conduction
angle: α
0
VR = 20 V
0.0
0.2
0.4
0.6
0.8
1.0
1.2
Average forward current IF (AV) (A)
Ta max – IF (AV)
160
Device mounted on a glass-epoxy board
(board size: 50 mm × 50 mm,
140
land size: 6 mm × 6 mm)
120
100
80
α = 60°
60 Rectangular
waveform
40
0° α 360°
20 Conduction
angle: α
0 VR = 20 V
0.0
0.2
120°
0.4
0.6
180°
0.8
DC
1.0
1.2
Average forward current IF (AV) (A)
Tℓ max – IF (AV)
160
140
120
100
80
α = 60° 120°
180°
DC
Rectangular
60 waveform
40
0° α 360°
20 Conduction
angle: α
VR = 20 V
0
0.0
0.2
0.4
0.6
0.8
1.0
1.2
Average forward current IF (AV) (A)
rth (j-a) – t
10000
(2) Device mounted on a glass-epoxy board:
board size:50 mm × 50 mm
Soldering land: 6.0 mm × 6.0 mm
board thickness:1.6 mm
1000 (3) Device mounted on a glass-epoxy board:
Board size: 50 mm × 50 mm
Standard Soldering pad
(3)
board thickness:1.6 mm
(2)
100
(1)
10
1
0.001
0.01
(1) Device mounted on a ceramic board:
board size:50 mm × 50 mm
Soldering land: 2.0 mm × 2.0 mm
board thickness : 0.64 mm
0.1
1
10
Time t (s)
100
1000
3
2013-11-01
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