CUS01 Просмотр технического описания (PDF) - Toshiba
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Компоненты Описание
производитель
CUS01 Datasheet PDF : 5 Pages
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IF – VF
10
Tj = 125°C
1
75°C
25°C
0.1
0.01
0
Pulse test
0.2
0.4
0.6
0.8
1.0
Forward voltage VF (V)
CUS01
PF (AV) – IF (AV)
0.5
DC
0.4
180°
120°
0.3
α = 60°
0.2
Rectangular
waveform
0.1
0° α 360°
Conduction
angle: α
0
0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6
Average forward current IF (AV) (A)
Ta max – IF (AV)
140
Device mounted on a ceramic board:
board size: 50 mm × 50 mm
120
Soldering land size: 2 mm × 2 mm
board thickness: 0.64 mm
100
80
60
Rectangular waveform
40
20 0° α 360°
Conduction angle: α
α = 180°
DC
0
VR = 15 V
0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6
Average forward current IF (AV) (A)
Tℓ max – IF (AV)
140
120
100
80
α = 60° 120°
60 Rectangular
waveform
40
0° α 360°
20
Conduction
angle: α
0 VR = 15 V
0 0.2 0.4 0.6 0.8
180°
1.0 1.2
DC
1.4 1.6
Average forward current IF (AV) (A)
1000
100
rth (j-a) – t
Device mounted on a glass-epoxy board:
board size: 50 mm × 50 mm
Soldering land size : 6 mm × 6 mm
board thickness: 1.6 mm
Device mounted on a ceramic board:
10
board size : 50 mm × 50 mm
Soldering land size: 2 mm × 2 mm
board thickness: 0.64 mm
1
0.001
0.01
0.1
1
10
Time t (s)
100
1000
3
2018-07-11
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