CRG04 Просмотр технического описания (PDF) - Toshiba
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производитель
CRG04 Datasheet PDF : 4 Pages
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IF – VF
10
Tj = 150°C
1
75°C
25°C
0.1
0.01
0
Pulse test
0.4
0.8
1.2
1.6
2.0
Forward voltage VF (V)
Ta max – IF (AV)
160
Device mounted on a glass-epoxy board:
board size: 50 mm × 50 mm
140
Soldering land size: 6 mm × 6 mm
board thickness: 1.6 mm
120
100
80
60 Half-sine waveform
40
20
0°
180°
Conduction angle 180°
0
0
0.2
0.4
0.6
0.8
1.0
1.2
Average forward current IF (AV) (A)
CRG04
PF (AV) – IF (AV)
1.2
1.0
0.8
0.6
0.4
Half-sine waveform
0.2
0°
180°
Conduction angle 180°
0
0
0.2
0.4
0.6
0.8
1.0
1.2
Average forward current IF (AV) (A)
Ta max – IF (AV)
160
Device mounted on a ceramic board:
board size: 50 mm × 50 mm
140
Soldering land: 2 mm × 2 mm
board thickness: 0.64 mm
120
100
80
60 Half-sine waveform
40
20
0°
180°
Conduction angle 180°
0
0
0.2
0.4
0.6
0.8
1.0
1.2
Average forward current IF (AV) (A)
Repetitive peak forward current
16
Ta = 25°C
f = 50 Hz
12
8
4
0
1
10
100
Number of cycles
10000
rth (j-a) – t
1000
100
Device mounted on a glass-epoxy board:
board size: 50 mm × 50 mm
Soldering land size: 6 mm × 6 mm
board thickness: 1.6 mm
10
1
0.001
0.01
Device mounted on a ceramic board:
board size: 50 mm × 50 mm
Soldering land: size 2 mm × 2 mm
board thickness: 0.64 mm
0.1
1
Time t (s)
10
100
3
2019-04-22
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