CRCW0805-HP Просмотр технического описания (PDF) - Vishay Semiconductors
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CRCW0805-HP Datasheet PDF : 10 Pages
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TESTS AND REQUIREMENTS
All executed tests are carried out in accordance with the
following specifications:
EN 60115-1, generic specification
EN 60115-8 (successor of EN 140400), sectional
specification
EN 140401-802, detail specification
IEC 60068-2-xx, test methods
The parameters stated in the Test Procedures and
Requirements table are based on the required tests
and permitted limits of EN 140401-802. The table presents
only the most important tests, for the full test schedule refer
to the documents listed above. However, some additional
tests and a number of improvements against those
minimum requirements have been included.
CRCW-HP e3
Vishay Draloric
The testing also covers most of the requirements specified
by EIA/IS-703 and JIS-C-5201-1.
The tests are carried out under standard atmospheric
conditions in accordance with IEC 60068-1, 4.3, whereupon
the following values are applied:
Temperature: 15 °C to 35 °C
Relative humidity: 25 % to 75 %
Air pressure: 86 kPa to 106 kPa (860 mbar to 1060 mbar).
A climatic category LCT / UCT / 56 is applied, defined by the
lower category temperature (LCT), the upper category
temperature (UCT), and the duration of exposure in the
damp heat, steady state test (56 days).
The components are mounted for testing on boards in
accordance with EN 60115-8, 2.4.2 unless otherwise
specified.
TEST PROCEDURES AND REQUIREMENTS
IEC
EN 60115-1 60068-2 (1)
CLAUSE
TEST
METHOD
TEST
PROCEDURE
Stability for product types:
CRCW-HP e3
4.5
-
Resistance
-
4.8
4.25.1
-
Temperature
coefficient
(20 / -55 / 20) °C and
(20 / 155 / 20) °C
U = P70 x R or U = Umax.;
whichever is the less severe;
-
Endurance at 70 °C
1.5 h on; 0.5 h off
70 °C; 1000 h
70 °C; 8000 h
4.25.3
Endurance at
-
upper category
temperature
155 °C, 1000 h
4.24
78 (Cab)
Damp heat,
steady state
(40 ± 2) °C; 56 days;
(93 ± 3) % RH;
Damp heat,
(85 ± 2) °C; (85 ± 5) % RH;
4.37
67 (Cy)
steady state,
U = 0.1 x P85 x R 100 V;
accelerated
1000 h
4.23
-
Climatic sequence:
-
4.23.2
2 (Bb)
dry heat
125 °C; 16 h
4.23.3
30 (Db) damp heat, cyclic
55 °C; 24 h; 90 % RH;
1 cycle
4.23.4
1 (Ab)
cold
-55 °C; 2 h
4.23.5
13 (M)
low air pressure
8.5 kPa; 2 h; (25 ± 10) °C
4.23.6
30 (Db) damp heat, cyclic
55 °C; 24 h;
90 % RH;
5 cycles
4.23.7
-
-
1 (Aa)
DC load
Cold
U = P70 x R Umax.; 1 min
-55 °C; 2 h
REQUIREMENTS
PERMISSIBLE CHANGE (R)
STABILITY CLASS 2 OR BETTER
1 to 1 M
± 0.5 %; ± 1 %; ± 5 %
± 100 ppm/K; ± 200 ppm/K
± (2 % R + 0.1 )
± (4 % R + 0.1 )
± (2 % R + 0.1 )
± (1 % R + 0.05 )
± (2 % R + 0.1 )
± (2 % R + 0.1 )
± (0.5 % R + 0.05 )
Revision: 27-Oct-2020
7
Document Number: 20043
For technical questions, contact: thickfilmchip@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
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