MOC8101S_05 Просмотр технического описания (PDF) - Fairchild Semiconductor
Номер в каталоге
Компоненты Описание
производитель
MOC8101S_05 Datasheet PDF : 15 Pages
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White Package (-M Suffix)
Package Dimensions (Through Hole)
0.350 (8.89)
0.320 (8.13)
Pin 1 ID
0.260 (6.60)
0.240 (6.10)
Package Dimensions (Surface Mount)
0.350 (8.89)
0.320 (8.13)
Pin 1 ID
0.390 (9.90)
0.260 (6.60) 0.332 (8.43)
0.240 (6.10)
0.070 (1.77)
0.040 (1.02)
0.200 (5.08)
0.115 (2.93)
0.014 (0.36)
0.010 (0.25)
0.100 (2.54)
0.015 (0.38)
0.020 (0.50)
0.016 (0.41)
0.100 (2.54)
0.320 (8.13)
15°
0.012 (0.30)
0.070 (1.77)
0.040 (1.02)
0.200 (5.08)
0.115 (2.93)
0.025 (0.63)
0.020 (0.51)
0.020 (0.50)
0.016 (0.41)
0.014 (0.36)
0.010 (0.25)
0.320 (8.13)
0.012 (0.30)
0.008 (0.20)
0.100 [2.54]
0.035 (0.88)
0.012 (0.30)
Package Dimensions (0.4” Lead Spacing)
0.350 (8.89)
0.320 (8.13)
PIN 1 ID
0.260 (6.60)
0.240 (6.10)
0.070 (1.77)
0.040 (1.02)
0.014 (0.36)
0.010 (0.25)
0.200 (5.08)
0.115 (2.93)
0.100 (2.54)
0.015 (0.38)
0.020 (0.50)
0.016 (0.41)
0.100 [2.54]
0.012 (0.30)
0.008 (0.21)
0.425 (10.80)
0.400 (10.16)
Recommended Pad Layout for
Surface Mount Leadform
(White Package Only)
0.070 (1.78)
0.060 (1.52)
0.425 (10.79)
0.100 (2.54)
0.305 (7.75)
0.030 (0.76)
NOTE
All dimensions are in inches (millimeters)
11
CNY17X, CNY17FX, MOC810X Rev. 1.0.5
www.fairchildsemi.com
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