MOC8101300_05 Просмотр технического описания (PDF) - Fairchild Semiconductor
Номер в каталоге
Компоненты Описание
производитель
MOC8101300_05 Datasheet PDF : 15 Pages
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Black Package (No -M Suffix)
Package Dimensions (Through Hole)
PIN 1
ID.
0.270 (6.86)
0.240 (6.10)
0.070 (1.78)
0.045 (1.14)
0.350 (8.89)
0.330 (8.38)
0.200 (5.08)
0.115 (2.92)
0.154 (3.90)
0.100 (2.54)
0.022 (0.56)
0.016 (0.41)
0.100 (2.54)
TYP
0.020 (0.51)
MIN
0.016 (0.40)
0.008 (0.20)
0° to 15°
0.300 (7.62)
TYP
Package Dimensions (Surface Mount)
0.350 (8.89)
0.330 (8.38)
3
2
1
PIN 1
ID.
0.270 (6.86)
0.240 (6.10)
4
5
6
0.070 (1.78)
0.045 (1.14)
0.200 (5.08)
0.165 (4.18)
0.022 (0.56)
0.016 (0.41)
0.020 (0.51)
MIN
0.100 (2.54)
TYP
Lead Coplanarity : 0.004 (0.10) MAX
0.300 (7.62)
TYP
0.016 (0.40) MIN
0.315 (8.00)
MIN
0.405 (10.30)
MAX
0.016 (0.41)
0.008 (0.20)
Package Dimensions (0.4” Lead Spacing)
PIN 1 ID
0.270 (6.86)
0.240 (6.10)
0.350 (8.89)
0.330 (8.38)
0.070 (1.78)
0.045 (1.14)
0.200 (5.08)
0.135 (3.43)
0.154 (3.90)
0.100 (2.54)
0.022 (0.56)
0.016 (0.41)
0.004 (0.10)
MIN
0.100 (2.54) TYP
0.016 (0.40)
0.008 (0.20)
0° to 15°
0.400 (10.16)
TYP
Recommended Pad Layout for
Surface Mount Leadform
(Black Package Only)
0.070 (1.78)
0.060 (1.52)
0.415 (10.54)
0.100 (2.54)
0.295 (7.49)
0.030 (0.76)
NOTE
All dimensions are in inches (millimeters)
10
CNY17X, CNY17FX, MOC810X Rev. 1.0.5
www.fairchildsemi.com
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