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CM1430 Просмотр технического описания (PDF) - ON Semiconductor

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производитель
CM1430 Datasheet PDF : 11 Pages
1 2 3 4 5 6 7 8 9 10
CM1430
Mechanical Details
CM1430-04DF/DE Mechanical Specifications
Dimensions for the CM1430-04DF/DE suplied in a 8-lead, 0.4mm pitch TDFN package are presented below.
For complete information on the TDFN-8, see the California Micro Devices TDFN Package Information
document.
PACKAGE DIMENSIONS
Package
TDFN
JEDEC
No.
Leads
MO-229C
8
Dim.
Millimeters
Inches
Min Nom Max Min Nom Max
A
0.70 0.75 0.80 0.028 0.030 0.031
A1
0.00 0.02 0.05 0.000 0.001 0.002
A3
0.20 REF
0.008 REF
b
0.15 0.20 0.25 0.006 0.008 0.010
D
1.60 1.70 1.80 0.063 0.067 0.071
D2
1.10 1.20 1.30 0.043 0.047 0.051
E
1.25 1.35 1.45 0.049 0.053 0.057
E2
0.30 0.40 0.50 0.012 0.016 0.020
e
0.40 BSC
0.016 BSC
K
0.20
0.008
L
0.15 0.25 0.35 0.006 0.010 0.014
# per
tape and
reel
3000 pieces
Controlling dimension: millimeters
This package is compliant with JEDEC standard MO-229C with the
exception of the "D", "D2", "E", "E2", "K" and "L" dimensions as
called out in the table above.
Dimensions for 8-Lead, 0.4mm pitch
TDFN package
Rev. 2 | Page 8 of 11 | www.onsemi.com

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