CM1420 Просмотр технического описания (PDF) - California Micro Devices Corp
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CM1420 Datasheet PDF : 12 Pages
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CM1420/22
Mechanical Details
CM1420/22 devices are packaged in a custom Chip
Scale Packages (CSP). Dimensions for each of these
devices are presented in the following pages.
CM1420 Mechanical Specifications
The package dimensions for the CM1420 are pre-
sented below.
PACKAGE DIMENSIONS
Package
Custom CSP
Bumps
15
Millimeters
Inches
Dim
Min Nom Max Min Nom Max
A1 2.915 2.960 3.005 0.1148 0.1165 0.1183
A2 1.285 1.330 1.375 0.0506 0.0524 0.0541
B1 0.495 0.500 0.505 0.0195 0.0197 0.0199
B2 0.245 0.250 0.255 0.0096 0.0098 0.0100
B3 0.430 0.435 0.440 0.0169 0.0171 0.0173
B4 0.430 0.435 0.440 0.0169 0.0171 0.0173
C1 0.180 0.230 0.280 0.0071 0.0091 0.0110
C2 0.180 0.230 0.280 0.0071 0.0091 0.0110
D1 0.600 0.670 0.739 0.0236 0.0264 0.0291
D2 0.394 0.445 0.495 0.0155 0.0175 0.0195
# per tape and
reel
3500 pieces
Controlling dimension: millimeters
Mechanical Package Diagrams
BOTTOM VIEW
A1
C1
B2
B1
C
B
A
123456
0.30 DIA.
63/37 Sn/Pb (Eutectic) or
95.5/3.8/0.7 Sn/Ag/Cu (Lead-free)
SOLDER BUMPS
OptiGuardTM
Coating
D1
D2
SIDE
VIEW
DIMENSIONS IN MILLIMETERS
Package Dimensions for
CM1420 Chip Scale Package
© 2004 California Micro Devices Corp. All rights reserved.
10 430 N. McCarthy Blvd., Milpitas, CA 95035-5112 ▲ Tel: 408.263.3214
▲ Fax: 408.263.7846 ▲ www.calmicro.com
04/27/04
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