CM1293A(2012) Просмотр технического описания (PDF) - ON Semiconductor
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производитель
CM1293A Datasheet PDF : 9 Pages
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SCALE 2:1
D
65 4
HE
12 3
E
b
e
0.05 (0.002)
A
A1
CM1293A
PACKAGE DIMENSIONS
SC−74
CASE 318F−05
ISSUE N
q
C
L
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. MAXIMUM LEAD THICKNESS INCLUDES
LEAD FINISH THICKNESS. MINIMUM LEAD
THICKNESS IS THE MINIMUM THICKNESS
OF BASE MATERIAL.
4. 318F−01, −02, −03, −04 OBSOLETE. NEW
STANDARD 318F−05.
MILLIMETERS
DIM MIN NOM MAX
A 0.90
1.00
1.10
A1 0.01
0.06
0.10
b
0.25
0.37
0.50
c
0.10
0.18
0.26
D 2.90
3.00
3.10
E 1.30
1.50
1.70
e
0.85
0.95
1.05
L
0.20
0.40
0.60
H E 2.50
2.75
3.00
q
0°
−
10°
MIN
0.035
0.001
0.010
0.004
0.114
0.051
0.034
0.008
0.099
0°
INCHES
NOM
0.039
0.002
0.015
0.007
0.118
0.059
0.037
0.016
0.108
−
MAX
0.043
0.004
0.020
0.010
0.122
0.067
0.041
0.024
0.118
10°
SOLDERING FOOTPRINT*
2.4
0.094
1.9
0.074
0.7
0.028
0.95
0.037
0.95
0.037
1.0
0.039
ǒ Ǔ SCALE 10:1
mm
inches
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
http://onsemi.com
8
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