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CM1418-02CP Просмотр технического описания (PDF) - California Micro Devices Corp

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производитель
CM1418-02CP Datasheet PDF : 8 Pages
1 2 3 4 5 6 7 8
Mechanical Details
CM1418 CSP Mechanical Specifications
The CM1418 is supplied in 6-bump Chip Scale Pack-
age (CSP). Dimensions are presented below.
PACKAGE DIMENSIONS
Package
Custom CSP
Bumps
6
Dim
Millimeters
Inches
Min Nom Max Min Nom Max
A1 1.175 1.220 1.265 0.0463 0.0480 0.0498
A2 1.675 1.720 1.765 0.0659 0.0677 0.0695
B1 0.495 0.500 0.505 0.0195 0.0197 0.0199
B2 0.495 0.500 0.505 0.0195 0.0197 0.0199
C1 0.310 0.360 0.410 0.0122 0.0142 0.0161
C2 0.310 0.360 0.410 0.0122 0.0142 0.0161
D1 0.562 0.606 0.650 0.0221 0.0239 0.0256
D2 0.356 0.381 0.406 0.0140 0.0150 0.0160
D3 0.575 0.644 0.714 0.0226 0.0254 0.0281
D4 0.368 0.419 0.470 0.0145 0.0165 0.0185
# per tape and
reel
3500 pieces
Controlling dimension: millimeters
PRELIMINARY
CM1418
Mechanical Package Diagrams
Non-Coated CSP
BOTTOM VIEW
A1
C1
B1
3
2
1
BA
D1
0.30 DIA.
D2
63/37 Sn/Pb (Eutectic) or
96.8/2.6/0.6 Sn/Ag/Cu (Lead-free)
SOLDER BUMPS
SIDE
VIEW
OptiGuardCoated CSP
BOTTOM VIEW
A1
C1
B1
OptiGuardTM
Coating
3
2
1
BA
D3
0.30 DIA.
D4
63/37 Sn/Pb (Eutectic) or
96.8/2.6/0.6 Sn/Ag/Cu (Lead-free)
SOLDER BUMPS
SIDE
VIEW
NOTE: DIMENSIONS IN MILLIMETERS
Package Dimensions for CM1418-0xCS/CP
6-bump Chip Scale Package
© 2005 California Micro Devices Corp. All rights reserved.
12/13/05
490 N. McCarthy Blvd., Milpitas, CA 95035-5112 Tel: 408.263.3214 Fax: 408.263.7846 www.cmd.com 7

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