CM1203-01CS Просмотр технического описания (PDF) - California Micro Devices Corp

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CM1203-01CS

1, 2 and 3-Channel ESD Arrays in CSP

California Micro Devices Corp 

CM1203

PACKAGE / PINOUT DIAGRAMS

TOP VIEW

(Bumps Down View)

Orientation

Marking

(see note 2)

12

A

n*

B

BOTTOM VIEW

(Bumps Up View)

A2 A1

B2 B1

Orientation

Marking

* See ordering information for

appropriate part marking.

CM1203

4-Bump CSP Package

Notes:

1) These drawings are not to scale.

2) Lead-free devices are specified by using a "+" character for the top side orientation mark.

3) All 4 bumps are always present. Unused bumps are electrically unconnected.

Ordering Information

PART NUMBERING INFORMATION

Bumps

4

4

4

Package

CSP

CSP

CSP

Standard Finish

Ordering Part

Number1

Part Marking

CM1203-01CS

P

CM1203-02CS

Q

CM1203-03CS

R

Lead-free Finish2

Ordering Part

Number1

Part Marking

CM1203-01CP

P

CM1203-02CP

Q

CM1203-03CP

R

Note 1: Parts are shipped in Tape & Reel form unless otherwise specified.

Note 2: Lead-free devices are specified by using a "+" character for the top side orientation mark.

© 2004 California Micro Devices Corp. All rights reserved.

2 430 N. McCarthy Blvd., Milpitas, CA 95035-5112 ● Tel: 408.263.3214 ● Fax: 408.263.7846 ● www.calmicro.com 06/28/04

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